ICMCTF1998 Advanced Materials in Microelectronics Sessions

Click a Session Code to view its Abstracts

Topics | Time Periods | Schedule Overview

Session Code Start Session Name
H7- Monday, April 27, 1998 8:30 AM Technological Challenges of 300mm IC Substrates
H6- Monday, April 27, 1998 1:30 PM Interconnect Integration
H4- Tuesday, April 28, 1998 8:30 AM Silicides
H5- Tuesday, April 28, 1998 1:30 PM Silicon Contact Tehnology
H1- Wednesday, April 29, 1998 8:30 AM Advanced Metalization: Materials and Processes
H1-2- Wednesday, April 29, 1998 1:30 PM Advanced Metalization: Materials and Processes (2)
HP- Wednesday, April 29, 1998 5:00 PM H - Posters
H2- Thursday, April 30, 1998 8:30 AM Advanced Dielectrics and Planarization: Materials and Processes
H3- Thursday, April 30, 1998 1:30 PM Chemical Mechanical Polishing
Topics | Time Periods | Schedule Overview