ICMCTF2004 Thursday Morning

Sessions | Time Periods | Topics | Schedule Overview

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Session Thursday, April 22, 2004
8:30 AM 9:30 AM 10:30 AM 11:30 AM
Architectural Structure Changes In Atmospheric Plasma Spraying WCCo Coatings For Improving Corrosion Response
Structural Analysis of AISI-SAE 4140 Steel Nitrided by Post-discharge Assisted Nitriding Process
Sulphidation Behaviour of Siliconised Mo and Nb by Pack Cementation at 850°C
The Influence of the Oxidation Behaviour on the Thermal Stability of Hard PVD Coatings.
Relationship between Particle Erosion and Lamellar Microstructure for Plasma Sprayed Alumina Coatings
Study of Pit Initiation on Ar Implanted Stainless Steel
Low-temperature Thin-electrolyte Solid Oxide Fuel Cells
YSZ Electrolyte Coatings on Porous Electrodes of Solid Oxide Fuel Cells Using Combustion Chemical Vapor Deposition
Conductive Oxide Coatings on Ferritic Alloy for Solid Oxide Fuel Cell Interconnect Application
High Temperature Oxidation Resistance and Surface Electrical Conductivity of Stainless Steels with Filtered Arc CrAlN Superlattice Multilayer Coatings
Recent Developments in Pulsed Magnetron Sputtering
A Simplified Treatment of Target Implantation Effects in Reactive Sputtering
Plasma Diagnostical Comparison of the MSIP Process of (Ti,Al)N with Pulsed and DC Power Supplies using Energy Resolved Mass Spectroscopy
Erosion Resistant Properties of Magnetron Sputtering Deposited Ti1-xAlxNy Coatings
Deposition of CrN-MoS2 Thin Films by D. C. Magnetron Sputtering
Elaboration and Characterization of Thin Films of ZrBN Deposited by Triode PVD Prossec
Zirconia-metal Oxide Nanolaminate Films
Pvd-Al2o3 Coated Cemented Carbide Cutting Tools
Deposition of α-Alumina Hard Coatings by Reactive Magnetron Sputtering
Nanostructured Nitride Films of Multi-element High-entropy Alloys by Reactive Sputtering
The Interface TiN-Si3N4: a Model for the Bonding in Hard Nanocomposites
Modelling Nitrogen Atom Flux in Post-discharge Nitriding Processes
The Influence of Ion Implantation during Reactive Sputtering
Parameter Analysis of Reactive Sputtering Process with Surface Kinetics and Plasma Chemistry
Single Particle Impact Modeling in Multilayered PVD Coatings for Erosion Protection
Composite Coatings for Mg Alloys Based on Oxide Ceramic Layers Produced using Plasma Electrolysis
Optical Characteristics of Oxide Coatings on Aluminium Alloys Produced by Pulsed Bipolar Plasma Electrolysis
Novel Hard and Wear Resistant Coatings on Aluminium Alloys Produced by Plasma Electrolytic Oxidation
Oxide/lubricant Composite Coatings Deposited by using Electrolytic Plasma Process
An Overview on the Tribological Behavior of DLC in Technical and Medical Applications
Microstructure of Amorphous Diamond-like Carbon Thin Films and Changes during Wear
Tribological Analysys of Amorphous Carbon Coatings for Valve Train Components
Tribological Performance of DLC at Elevated Temperatures
Effects of High-temperature Hydrogenation Treatment on Sliding Friction and Wear Behavior of Carbide-derived Carbon Films
Tribological Characterization of Amorphous Hard Carbon (ta-C) Coating at Room Temperature; Effect of Counterbody Materials and Humidity
Tribological Behavior of Diamond-like Carbon Films in Aqueous Environment
Nano-impact Testing - an Effective Tool for Assessing the Resistance of Advanced Wear-resistant Coatings to Fatigue Failure and Delamination
Ferroelectric Thin Films on Silicon Carbide for Next Generation Nonvolatile Memory and Sensor Devices
A Modeling of the Optical Properties of Thin ZnO-ZnMgO Films in a Double Barrier-quantum Well Structure
High Density Ge Quantum Dots Prepared by High-vacuum Ion-beam Sputtering
New Metal Layers for Integrated Circuit Manufacture: Experimental and Modeling Studies
Characterization of Hot Wall Epitaxy Grown AgGaTe2 Films on KCI Substrate
Mechanism of High Density Plasma CVD Phosphosilicate Glass Process without In-situ Plasma Chamber Clean
Oxide Mediated Epitaxy Salicide Formation on Different Dopant Type of Si Surface
Investigation of Electro-plating Voltage Effect on the Copper Electrodeposition Technology
Integration Solution for Dishing & Erosion Elimination in Copper Process beyond 0.13 um Technology
Sessions | Time Periods | Topics | Schedule Overview